DOD doubles ceiling on multi-billion microelectronic contract
By
Ross Wilkers
The Defense Department’s lead agency for designing and prototyping microelectronics has more than doubled the ceiling on a technology insertion contract awarded four years ago.
The Defense Department’s lead agency for designing and prototyping microelectronics has more than doubled the ceiling on a contract awarded four years ago for technology insertions and applications.
Under a modification DOD announced Thursday, the original eight awardees will now vie for an overall pie of $17.4 billion in potential orders versus the prior $7.2 billion ceiling for the Advanced Technology Support Program IV contract.
Companies with spots on the contract include BAE Systems Inc., Boeing, Cobham Advanced Electronic Solutions, General Dynamics, Honeywell, Lockheed Martin, Northrop Grumman and the new Raytheon Technologies.
ATSP IV is part of DOD’s overall effort to more quickly update obsolete, unreliable, unmaintainable, underperforming or incapable microelectronic components in weapons and other more complex systems.
Work can involve development of both hardware and software to provide the new microelectronics.
Even with the new ceiling, the contract’s ordering period end remains the same as March 31, 2026.
DOD chose three businesses for the program’s potential $800 million small business portion two years ago.